With the help of Samsung Electro-Mechanics, Apple is continuing to develop its upcoming “M2” chip, ET News Report.
Samsung Electro-Mechanics supplies the M1 chip with a flip-chip ball grid array (FC-BGA), a printed circuit board used to connect semiconductor chips to the main substrate.This detail didn’t emerge until nearly a year after the “M1” chip was introduced, when it was Electricity.
While the “M1”, like all of Apple’s custom silicon SoCs, is exclusively manufactured by Taiwan’s TSMC, the chip includes components from multiple suppliers. For example, the boards for the chip are provided by Ibiden and Unimicron, so Apple needs to coordinate multiple suppliers for its next-generation SoC for Macs.
According to today’s report ET News, Samsung is expected to continue to provide FC-BGA for the “M2”. The company is said to be working with Apple on the “M2” chip and will complete work on its FC-BGA this year.
Apple allegedly started developing the “M2” immediately after launching the “M1” chip. The report reiterates Mark Gurman’s claim that Apple is testing at least nine new Macs with four different M2 chip variants, and that the first M2-equipped devices could debut in the first half of 2022. The chip may first be introduced into Apple’s redesigned MacBook Air.
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